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1. CU3300

TECHNIC CU 3300 is designed for through-hole printed circuit board applications as a high throw, micro-leveling acid copper electroplating process. The electrodeposits produced by the TECHNIC CU 3300 process are fine grained equiaxed, high purity, ductile copper deposits from a three additive system, providing advanced technology from an economical solution that will meet or exceed all the requirements of MIL-P-55110-F and BS9760.

All of the components in the process are fully analyzable and the TECHNIC CU 3300 process is specifically optimized for on-line analysis and control by the Technic Real Time Analyzer (RTA) automated bath analysis equipment.

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